The SFY Ultrasonic Machining Center combines high-rigidity structural design with advanced ultrasonic technology to deliver a perfect balance of speed and precision. Engineered to overcome the limitations of traditional machining, this series provides a superior solution for processing the world’s most challenging materials with minimal stress and maximum yield.
Advanced Technological Integration:
Versatile Ultrasonic Solutions: Available with a dedicated high-performance ultrasonic spindle or a traditional spindle with an add-on ultrasonic tool holder, offering flexible configurations tailored to your specific production needs.
Superior Edge Integrity: Specifically designed for hard and brittle materials, our ultrasonic technology significantly reduces residual processing stress. This minimizes edge chipping and micro-cracking, ensuring the integrity of delicate components.
Optimized Surface Quality: By utilizing high-frequency micro-vibrations, our machines achieve exceptional surface smoothness (Ra). This often eliminates or drastically reduces the need for time-consuming secondary polishing processes.
Driving Efficiency and Tool Longevity:
Non-Stick Tooling Performance: The high-frequency vibration prevents debris buildup and tool sticking. This self-cleaning effect leads to extended tool life and consistent cutting performance.
High-Speed, Low-Stress Cutting: Reduces cutting resistance and thermal impact, allowing for faster processing times while protecting the structural integrity of the workpiece.
Targeted Materials & Applications Our CNC Ultrasonic Machining Centers are essential for high-precision manufacturing in the Semiconductor, Optoelectronics, and Medical sectors:
Hard & Brittle Materials: Quartz, Glass, Ceramics (Alumina, Silicon Carbide), Jewel, and Silicon. High-Hardness & Tough Alloys: Advanced composites and specialized metals used in aerospace and medical devices. Precision Components: Ideal for semiconductor wafer handling parts, optical lenses, and complex medical implants.
